X-Ray for PCBA
Automatic X-ray inspection utilizes the differences in different substances in X-ray absorption to inspect the parts and defects. Mainly used to inspect defects such as extremely fine spacing, extremely high density circuit boards, bridges, missing parts, and poor alignment during the assembly process. It can also use its tomography technology to detect internal defects in IC chips. This is the only way to detect the quality of the ball grid array and solder ball welding.