PCB Assembly Flow
1. Circuit board preparation: Firstly, it is necessary to prepare the circuit board, clean and dry it to ensure that the surface of the circuit board is clean and flat.
2. Solder paste printing: Use a solder paste printing machine to evenly print a thin layer of solder paste on the PCB, providing welding points for subsequent SMT patches. The uniformity and accuracy of solder paste directly affect the quality of subsequent patches.
3. Component mounting: Use an SMT mounting machine to mount electronic components to the designated location on the circuit board. This step requires high-precision equipment and skilled operators to ensure accurate installation of components.
4. Welding: By using welding equipment to weld components, the connection between the components and the circuit board is achieved. The choice of welding process will affect the quality and performance of the product. Bitelli Electronics adopts a high standard welding process to ensure the reliability of the product.
5. Testing and quality inspection: After welding is completed, the product is tested and inspected. Including electrical performance testing, appearance quality testing, etc., to ensure that the product meets design requirements.
6. Cleaning and drying: Clean and dry the PCBA board to remove impurities and moisture from the surface, and prepare for subsequent processes.
7. Finished product inspection and packaging: Finally, the finished product is inspected, qualified products are selected for packaging, and then delivered to the customer.